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| PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers Rev. 03 -- 10 August 2005 Product data sheet 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in small and flat lead Surface Mounted Device (SMD) plastic packages. Table 1: Product overview Package Philips PMEG2020EH PMEG2020EJ SOD123F SOD323F JEITA SC-90 single diode single diode Configuration Type number 1.2 Features s s s s Forward current: 2 A Reverse voltage: 20 V Very low forward voltage Small and flat lead SMD plastic package 1.3 Applications s s s s s Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Inverse polarity protection Low power consumption applications 1.4 Quick reference data Table 2: Symbol IF VR VF [1] Quick reference data Parameter forward current reverse voltage forward voltage IF = 2 A [1] Conditions Tsp 55 C Min - Typ 450 Max 2 20 525 Unit A V mV Pulse test: tp 300 s; 0.02. Philips Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 2. Pinning information Table 3: Pin 1 2 Pinning Description cathode anode [1] Simplified outline Symbol 1 2 sym001 1 001aab540 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4: Ordering information Package Name PMEG2020EH PMEG2020EJ SC-90 Description plastic surface mounted package; 2 leads plastic surface mounted package; 2 leads Version SOD123F SOD323F Type number 4. Marking Table 5: Marking codes Marking code A6 CA Type number PMEG2020EH PMEG2020EJ PMEG2020EH_EJ_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 -- 10 August 2005 2 of 10 Philips Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 5. Limiting values Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VR IF IFRM IFSM Ptot reverse voltage forward current repetitive peak forward current non-repetitive peak forward current total power dissipation PMEG2020EH PMEG2020EJ Tj Tamb Tstg [1] [2] Conditions Tsp 55 C tp 1 ms; 0.5 tp = 8 ms; square wave Tamb 25 C [1] [2] [1] [2] Min - Max 20 2 7 9 Unit V A A A -65 -65 375 830 360 830 150 +150 +150 mW mW mW mW C C C junction temperature ambient temperature storage temperature Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. 6. Thermal characteristics Table 7: Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient PMEG2020EH PMEG2020EJ Rth(j-sp) thermal resistance from junction to solder point PMEG2020EH PMEG2020EJ [1] Conditions in free air [1] [2] [1] [3] [1] [2] [1] [3] [4] Min Typ Max Unit - - 330 150 350 150 K/W K/W K/W K/W - - 60 55 K/W K/W For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Nomograms for determining the reverse power losses PR and IF(AV) rating will be available on request. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Soldering point of cathode tab. [2] [3] [4] PMEG2020EH_EJ_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 -- 10 August 2005 3 of 10 Philips Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 7. Characteristics Table 8: Characteristics Tamb = 25 C unless otherwise specified. Symbol VF Parameter forward voltage IF = 0.01 A IF = 0.1 A IF = 1 A IF = 2 A IR reverse current VR = 5 V VR = 10 V VR = 20 V Cd [1] Conditions [1] Min - Typ 200 260 370 450 15 20 45 50 Max 220 290 430 525 50 80 200 60 Unit mV mV mV mV A A A pF diode capacitance VR = 5 V; f = 1 MHz Pulse test: tp 300 s; 0.02. PMEG2020EH_EJ_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 -- 10 August 2005 4 of 10 Philips Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 104 IF (mA) 103 006aaa011 IR (mA) 102 10 1 (1) (2) 006aaa012 102 10-1 10-2 (3) 10 (1) (2) (3) (4) 10-3 10-4 1 10-5 10-1 0 0.1 0.2 0.3 0.4 VF (V) 0.5 10-6 0 (4) 5 10 15 VR (V) 20 (1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C (4) Tamb = -40 C (1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C (4) Tamb = -40 C Fig 1. Forward current as a function of forward voltage; typical values 200 Cd (pF) 150 Fig 2. Reverse current as a function of reverse voltage; typical values 006aaa013 100 50 0 0 5 10 15 VR (V) 20 Tamb = 25 C; f = 1 MHz Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG2020EH_EJ_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 -- 10 August 2005 5 of 10 Philips Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 8. Package outline 1.7 1.5 1 0.55 0.35 3.6 3.4 2.7 2.5 2.7 2.3 1.8 1.6 1.2 1.0 1.35 1.15 1 0.5 0.3 0.80 0.65 2 0.70 0.55 Dimensions in mm 0.25 0.10 04-11-29 Dimensions in mm 2 0.40 0.25 0.25 0.10 04-09-13 Fig 4. Package outline SOD123F Fig 5. Package outline SOD323F (SC-90) 9. Packing information Table 9: Packing methods The -xxx numbers are the last three digits of the 12NC ordering code. [1] Type number PMEG2020EH PMEG2020EJ [1] Package SOD123F SOD323F Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 -115 10000 -135 For further information and the availability of packing methods, see Section 16. PMEG2020EH_EJ_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 -- 10 August 2005 6 of 10 Philips Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 10. Soldering 4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2x) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 6. Reflow soldering footprint SOD123F 3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 (2x) msa433 Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 7. Reflow soldering footprint SOD323F (SC-90) PMEG2020EH_EJ_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 -- 10 August 2005 7 of 10 Philips Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 11. Revision history Table 10: Revision history Release date 20050810 Data sheet status Product data sheet Change notice Doc. number Supersedes PMEG2020EH_2 PMEG2020EJ_2 Document ID PMEG2020EH_EJ_3 Modifications: * * * * This data sheet is a combination of data sheets PMEG2020EH_2 and PMEG2020EJ_2. Table 6 "Limiting values": amended value for IFSM non-repetitive peak forward current Table 6 "Limiting values": added PMEG2020EJ values for Ptot total power dissipation Table 7: added PMEG2020EJ values for Rth(j-a) thermal resistance from junction to ambient Product data sheet Preliminary data sheet Product data sheet Preliminary data sheet 9397 750 15081 9397 750 14518 9397 750 14314 9397 750 13536 PMEG2020EH_1 PMEG2020EJ_1 - PMEG2020EH_2 PMEG2020EH_1 PMEG2020EJ_2 PMEG2020EJ_1 20050523 20050304 20050131 20040830 PMEG2020EH_EJ_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 -- 10 August 2005 8 of 10 Philips Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 12. Data sheet status Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). III Product data Production [1] [2] [3] Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 13. Definitions Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 15. Trademarks Notice -- All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Disclaimers Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 16. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com PMEG2020EH_EJ_3 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 03 -- 10 August 2005 9 of 10 Philips Semiconductors PMEG2020EH; PMEG2020EJ 20 V, 2 A very low VF MEGA Schottky barrier rectifiers 17. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 3 3 4 6 6 7 8 9 9 9 9 9 (c) Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 10 August 2005 Document number: PMEG2020EH_EJ_3 Published in The Netherlands |
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